ProductsLogic
Probe Head(WLCSP/Flip Chip)
130um pitch>
<350um pitch>
As an automotive antenna manufacturer that develops products to meet the needs of the IoT/5G (high-speed high-capacity communication) era, we will provide probeheads (Extra Fine/Short Pin) that combine high frequency technology, fine precision processing technology cultivated as a leading company in spring pin connectors, and advanced control technology to realize a measurement environment that meets both cost and performance requirement.
Photos are for reference only. Actual design will vary by customer specifications and test environment.
Overview
- Applicable devices
- WLCSP(Wafer Level Chip Scale Package) / Flip Chip(Pad, Bump, Cu pillar)
- Minimum Pitch
- ～130um
- Pin Length
- 2mm
- Features
-
- Fine pitch/ short pins
- High parallelism capable
High Pin Count Socket
As a single IC package becomes capable of many functions, the number of signals and power that must be transmitted simultaneously is increasing. Under these circumstances, the number of pins required for a single socket is also increasing. Our company selects the most suitable material and provides a test socket using our unique warpage control technology. Also, when making a proposal, we will provide an optimum structure based on warpage analysis and simulation to see if pins properly make contact with package.
Photos are for reference only. Actual design will vary by customer specifications and test environment.
Specs
- Supported Application
- FPGA, ASIC, CPU (PC/Server) etc
- Applicable package type
- QFN, BGA, LGA, etc
- Minimum Pitch
- 0.4mm～
- Maximum Pin Count
- Up to 7,000
- Features
-
- Optional coaxial structure available
- Maximum pin count up to 7,000 pins in a single socket
- Yokowo will propose optimized structure based on warpage/contact simulation
Coaxial Socket - for Final Test
Plastic Sandwich type
Insulator Ring Type
Simulation image
Photos are for reference only. Actual design will vary by customer specifications and test environment.
For applications that require high RF performance, our company offers coaxial sockets that are ideally suited to your budget and specifications. You can choose from two different socket structures. Yokowo has electrical simulation capability to propose optimized solution for each customer.
Overview
- Application
- FPGA, ASIC, CPU (PC/Server),Storage, etc
- Applicable Package Type
- QFN, BGA, LGA, etc
- Minimum Pitch
- 0.4mm～
- Maximum Pin Count
- Up to 7,000
- Feartures
-
- We propose the optimized structure based on electrical simulation.
- You can select from two different structures.
- Ideal for high-speed testing and suitable for use in bands from 28 GHz or higher.
Low Inductance Probe Head/Socket
Our company's Low Inductance sockets use our company's unique socket configuration, which maintains a stable GND (ground) even under severe RF amplification application such as LNA (Low noise amplifier) and PA (power amplifier).
We provide a reliable measurement environment for our customers by providing not only electrical know-how such as high bandwidth and impedance matching, but also high-precision processing technology that realizes them as products.
Photos are for reference only. Actual design will vary by customer specifications and test environment.
Overview
- Applicable Package
- QFN, BGA, LGA, etc
- Minimum Pitch
- 0.4mm～
- Features
-
- Coaxial structure, low loss probe for RF transmission
- GND Enhancement Technology for High-Frequency RF Measurement
- 50Ω impedance matching