ProductsRF Device
Probe Head for WLCSP/Flip Chip - short pin solution
As an automotive antenna manufacturer, our company has a long history of supplying products to automotive manufacturers, and possesses technical knowledge and manufacturing facilities related to RF products. By leveraging our sophisticated RF system expertise in addition to our fine precision processing technologies, our company offers high performance probeheads at reasonable cost.
Photos are for reference only. Actual design will vary by customer specifications and test environment.
Overview
- Application
- RF Devices (Wireless tranceiver,etc)
- Applicable Package Type
- WLCSP(Wafer Level Chip Scale Package) / Flip Chip(Pad, Bump, Cu pillar)
- Minimum Pitch
- up to 130um
- Maximum Pin Count
- 2mm over
- Feartures
-
- Short height pin available (～2mm)
- Capable of handling large pin count : up to 8,000 (8 site)
- Capable of manufacturing large size package : 100mm x 100mm
Probe Head for WLCSP/Flip Chip - Coax solution
For wafer probing where high RF performance is required, Yokowo offers probe heads with unique coaxial structure. Yokowo has electrical simulation capability to propose and validate optimized solution for each customer.
Photos are for reference only. Actual design will vary by customer specifications and test environment.
Overview
- Application
- RF Devices (Wireless tranciever modem,etc)
- Applicable Package Type
- WLCSP(Wafer Level Chip Scale Package) / Flip Chip(Pad, Bump, Cu pillar)
- Pitch
- 0.4mm～
- Feartures
-
- Electrical performance simulation is available before fabrication
- Suitable for high RF testing
Membrane Type Probe Card - YPX/YPX K
YPX
As mobile phones and other electronic devices evolve at a rapid pace, front-end electronic components such as filters, switches, and amplifiers also evolve at a rapid pace. These applications are typically inspected before they are packaged. To keep up with these trends, our company offers a membrane-type contactor that uses its unique MEMS technology to form bumps on polyimide sheets. This membrane-type contactor reduces ground inductance by minimizing the distance from the contacts to the device, providing a test environment that is as close as possible to the actual usage environment.
YPX K
Photos are for reference only. Actual design will vary by customer specifications and test environment.
Overview
- Application
- Front end module : Different kinds of filters, amplifiers and switches
- Applicable product
- Wafer sort testing
- Feartures
-
- 50ohm impedance matching on the bottom of YPX Tip(50um)
- Good isolation by placing ground.
- Capable of placing small components close to DUT
- RF port(MAX16port)
| Min. Pitch | 80um(1 or 2 cylinder) 130um (4 cylinder) |
|---|---|
| Planarity | ≦ 10um |
| Mechanical max over drive | ≦ 350um |
| Spring force / pin | ≧ 0.049N (5gf) |
| Trace L/S | 30um/30um |
| Max. probe area | 10x10mm |
| Number of sites | Depends on the device size and layout |
| Max RF ports | YPX:16ports / YPX-K:24ports and more |
| Frequency | YPX:6GHz / YPX-K:40GHz |
*YPX-K spec is depending heavily on customer specifications
Capable of testing singulated die
Hand Socket Lid
Coaxial Socket - for Final Test
Plastic sandwich type
Insulator ring type
Simulation image
Photos are for reference only. Actual design will vary by customer specifications and test environment.
For applications that require high RF performance, our company offers coaxial sockets that are ideally suited to your budget and specifications. You can choose from two different socket structures. Yokowo has electrical simulation capability to propose optimized solution for each customer.
Overview
- Application
- FPGA, ASIC, CPU (PC/Server),Storage, etc
- Applicable Package Type
- QFN, BGA, LGA, etc
- Minimum Pitch
- 0.4mm～
- Maximum Pin Count
- Up to 7,000
- Feartures
-
- Yokowo propose the optimized structure based on electrical simulation.
- You can select from two different structures.
- Ideal for high-speed testing and suitable for use in bands from 28 GHz or higher.